Description
IC Chip Removal Curved Blade Tool for Mobile Repair
This IC Chip Removal Curved Blade Tool is a professional precision tool specially designed for mobile motherboard repair and micro-soldering work. The sharp curved blade helps technicians safely remove IC chips, clean underfill adhesive, scrape epoxy, and perform detailed PCB repair tasks with maximum accuracy. Built from high-quality alloy steel, it offers excellent durability, precision, and control for advanced smartphone repair applications.
Key Features:
- Specially designed for IC chip removal and motherboard repair
- Ultra-sharp curved blade for precision work
- Ideal for underfill glue and epoxy removal
- High-quality alloy steel construction
- Comfortable anti-slip metal handle
- Excellent control for micro-soldering applications
- Durable, corrosion-resistant, and long-lasting
- Suitable for professional mobile repair technicians
- Compatible with iPhone, Samsung, Xiaomi, Vivo, Oppo, OnePlus, and other smartphone motherboards
Applications:
- IC chip removal
- CPU and NAND repair work
- Underfill adhesive cleaning
- Epoxy glue scraping
- PCB trace repair preparation
- Motherboard maintenance and refurbishment
🛡️ Warranty Details
| Warranty Summary | 7 Days Replacement Warranty |
| Warranty Type | Replacement Warranty |
| Warranty Covered | Any Manufacturing Defect |
| Warranty Not Covered | Tempered, Physically Damaged or Used Product |
| Important Note | Unboxing video is mandatory for any return or replacement request |
| Country of Origin | China |
| Sold By | BSAS Mobile Service, Delhi |
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