Description

IC Chip Removal Curved Blade Tool for Mobile Repair

This IC Chip Removal Curved Blade Tool is a professional precision tool specially designed for mobile motherboard repair and micro-soldering work. The sharp curved blade helps technicians safely remove IC chips, clean underfill adhesive, scrape epoxy, and perform detailed PCB repair tasks with maximum accuracy. Built from high-quality alloy steel, it offers excellent durability, precision, and control for advanced smartphone repair applications.

Key Features:

Specially designed for IC chip removal and motherboard repair
Ultra-sharp curved blade for precision work
Ideal for underfill glue and epoxy removal
High-quality alloy steel construction
Comfortable anti-slip metal handle
Excellent control for micro-soldering applications
Durable, corrosion-resistant, and long-lasting
Suitable for professional mobile repair technicians
Compatible with iPhone, Samsung, Xiaomi, Vivo, Oppo, OnePlus, and other smartphone motherboards

Applications:

IC chip removal
CPU and NAND repair work
Underfill adhesive cleaning
Epoxy glue scraping
PCB trace repair preparation
Motherboard maintenance and refurbishment

🛡️ Warranty Details

Warranty Summary	7 Days Replacement Warranty
Warranty Type	Replacement Warranty
Warranty Covered	Any Manufacturing Defect
Warranty Not Covered	Tempered, Physically Damaged or Used Product
Important Note	Unboxing video is mandatory for any return or replacement request
Country of Origin	China
Sold By	BSAS Mobile Service, Delhi